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Current contact address
| Country | People's Republic of China |
|---|---|
| City | Beijing |
| Institution | Chinese Academy of Sciences (CAS) |
| Institute | Institute of Microelectronics, System Packaging Center |
Profile
| Research fields | Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering |
|---|---|
| Keywords | Advanced microsystem packaging , New electronic packaging materials , Reliability of electronic product and package |